技術探索

印刷電路板無光罩數位成像資料處理技術

中文摘要

現今印刷電路板製造無光罩光刻技術及其資料處理系統,在進入高精度領域時,同時面臨到多項問題亟待克服,即:(1)影像點陣化處理工作站運算負載(2)高解析度即時幾何縮放旋轉修正(3)龐大資料傳輸儲存等問題。本篇論文將介紹我們所設計之超高精度之無光罩數位成像資料處理架構,此架構適用於最小線寬1um製程,其基本概念是以多邊形資料格式取代像素的圖像格式執行必要的前處理,如漲縮與失真修正。依此概念,資料量將大幅減少,也因此將即時縮放/旋轉修正變為可能,進而可以實現更高解析度與精度的修正。此外,本文也將介紹新架構裡關鍵部分的兩個設計覆蓋演算法。

Abstract

At the time of entering the era of high-precision, current maskless lithography techniques (MLT) for printed circuit board (PCB) manufacturing, and the data preprocessing system thereof, are facing a number of challenges that need to be overcome, namely: (1) RIP workstation computing load, (2) high-resolution real-time geometric scaling/rotation correction, and (3) storage and transmission of enormous pattern data and other issues. In this paper, we will present a developed framework of data processing for ultra-high precision MLT, such as 1 um minimum line/space. The underlying idea of the framework is to perform necessary preprocessing, such as scale and distortion correction, on polygon-based data format instead of pixel-based image format. In this way, the total amount of data could be greatly reduced. Furthermore, the on-the-fly scaling/rotation correction thus become possible, and therefore, higher resolution and precision correction can be achieved. In addition, this article will also present two designed de-overlapped algorithms which are the key components of the framework.

關鍵詞(Key Words)

無光罩光刻 (Maskless Lithography;ML2)
雷射直接成像 (Laser Direct Imaging;LDI)
印刷電路板 (Printed Circuit Board;PCB)

相關檔案: 印刷電路板無光罩數位成像資料處理技術(全文)