中文摘要
過去在電子系統層級設計技術中，主要都是著重在純功能(Functionality)驗證上，而逐步發展至今日已能夠提供效能(Performance)分析、功率(Power)分析、甚至於熱(Thermal)分析等，有助於系統設計者進行早期架構探索、系統規格制訂、與軟硬體協同設計與驗證，對於提升系統設計效率、縮短整體設計時程、建立可執行系統規格(Executable Spec.)等皆有明顯效益，已逐步為國內業界所認同並開始採用，然而，當國內業者在實際導入時面臨許多問題與挑戰，這些問題包括：(1) 缺乏系統層級功率分析標準流程、(2) 缺乏基於TLM功率分析平台之智慧行動軟體協同設計技術。為了解決上述問題，本研究將以具高系統複雜度之穿戴式裝置(智慧眼鏡)為應用
載具，目標為開發下世代事務層級(TLM-based)功率分析平台與智慧行動軟體協同設計技術，並建立ESL Power Format業界標準。
Abstract
In the past, the electronic system-level (ESL) design techniques, it is mainly focused on a pure functionality verification. But today the technique has grown to provide performance analysis, power analysis, and even thermal analysis techniques. Those approaches can help system designers to perform design exploration, architecture specifications and HW/SW co-emulation at the early phases. Thereby improve system performance, shorten the overall design time and defining the executable specifications. The domestic companies began to recognize the potential and practicability of the concept. However, the domestic companies still faces various problems and challenges, these issues include: (1) the lack of standard processes for system-level power analysis, (2) the lack of transaction-level model (TLM) based VP with power analysis of smart mobile software development technology. To solve the above problems, this work target for the development of next-generation TLM-based platform with power analysis and smart mobile collaborative software development technology base on the high degree of complexity wearable device (smart glass), and then establish industry standards ESL power format.
關鍵詞(Key Words)
電子系統層級設計技術 (Electronic System Level；ESL)
軟硬體協同設計與驗證 (HW/SW Co-emulation)
功率分析 (Power Analysis)
相關檔案: 以狀態為基礎的電子系統層級功率分析方法(全文)
